3510 Low Temperature Epoxy Adhesive
3510
Overview
3510 Low Temperature Epoxy Adhesive
is a high-performance epoxy formulated specifically for electronic components, especially suitable for precision assembly such as memory cards, CCD/CMOS sensors, and fingerprint recognition modules. With a low glass transition temperature, strong adhesion, and low-temperature heat curing, it delivers reliable performance in high-reliability applications.
Features
- Color: Black
- Viscosity: 7,000–27,000 mPa·s
- Density: 1.6 g/cm³
- Recommended Curing Condition: 20 minutes @ 80°C
- Glass Transition Temperature (Tg): Pre-cure 45°C
- Coefficient of Thermal Expansion: Pre-cure 40×10⁻⁶ / Post-cure 130×10⁻⁶
- Shear Strength: 21 MPa
- Storage Conditions: -25 to -15°C
Product Overview
| Model | Color | Viscosity (mPa·s) | Density (g/cm³) | Recommended Curing | Glass Transition Temp (Tg °C) | CTE (K⁻¹) | Shear Strength (MPa) | Storage Condition |
|---|---|---|---|---|---|---|---|---|
| 3190 | Black | 27750 | 1.3 | 1h@100℃ | 135 | － | 39 | -25～15℃ |
| 3510 | Black | 7000–27000 | 1.6 | 20min@80℃ | 45 | Before Tg: 40×10⁻⁶ After Tg: 130×10⁻⁶ |
21 | -25～15℃ |
| 3520 | Black | 10000–20000 | 1.45 | 5–10min@80℃ | 35 | Before Tg: 55×10⁻⁶ After Tg: 162×10⁻⁶ |
≥13 | -25～15℃ |
| 3521 | White | 8–20 | 1.33 | 5min@80℃ | 51 | － | 18 | -25～15℃ |
Features
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Specifications
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